| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a wiring board by using conductive paste capable of forming a stable via hole conductor or the like, with excellent shape-keeping capability and embedding-filling capability by the conductive paste without deterioration of an insulation property by permeating of a resin constituent into an insulation board even if it is used as a filler of the via hole conductor or the like by improving wettability between metal particles and the resin constituent. SOLUTION: The via hole conductor 13 or the like in the wiring board is formed by using this conductive paste containing triallyl isocyanurate, a derivative such as 1-(2-hydroxypropyl)-3,5-di-2-propenyl-isocyanurate or 1,3-bis(2- hydroxypropyl)-5-(2-propenyl)-isocyanurate having a cyanuric acid skeleton containing a hydroxyl group as a substituted group and conductive powder comprising at least one kind selected from a group of gold, silver, palladium, copper, nickel, tin and lead. |
