| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique for simply mass-producing fine patterns, etc., having fine layouts of bumps used for mounting semiconductor devices or made of a material hard to process such as titanium, etc. SOLUTION: The method of manufacturing a pattern of powder aggregate on a base comprises a step of preparing a model pattern 1, using a material for giving a distribution of magnetic field to outside, a step of providing the base 2 on the pattern 1, a step of contacting a powder 3 of a material having fixed magnetization to the base 2 in a magnetic field to form a pattern 4 of powder aggregate along the model pattern 1 on the base 2, and a step of depositing the pattern 4 of the powder aggregate to the base 2.</p> |
