发明名称 COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide copper foil with carrier equipped with an insulating layer and a functional material layer and a printed circuit board using the same copper foil, with which the insulating layer and functional material layer of an area smaller than the area of the copper foil are formed on the surface of the copper foil with carrier by screen printing, the handlability of the copper foil is improved, a contaminant such as resin powder is not stuck on the surface of the copper foil in cutting, a flaw or mark of hitting caused by foreign substance can be prevented, and, moreover, flaws, creases or folds during cutting, packaging or transporting can be effectively prevented. SOLUTION: In the copper foil with carrier and the printed circuit board using the same copper foil, the resin layer and the functional material layer are provided in at least one part of the copper foil.</p>
申请公布号 JP2003101179(A) 申请公布日期 2003.04.04
申请号 JP20010292773 申请日期 2001.09.26
申请人 NIKKO MATERIALS CO LTD 发明人 NATSUME TAKASHI;AKASE FUMIAKI
分类号 H05K1/09;B32B15/08;H05K1/16;H05K3/00;H05K3/02;H05K3/46;(IPC1-7):H05K1/09 主分类号 H05K1/09
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