| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package exhibiting excellent transmission efficiency of high frequency signal. SOLUTION: A circuit board 6 placed on the upper surface of a shelf 2a located below the through hole 2b of a frame 2 is provided, on the upper surface thereof, with a line conductor 6a having one and the other end sides being connected electrically with a central conductor 3b and a semiconductor element 5, respectively, and coplanar ground conductors 6f formed on the opposite sides of the line conductor 6a. The coplanar ground conductor 6f is provided, on one end side thereof, with a wide interval 6c formed to extend by a specified length from the end of the circuit board 6 substantially in parallel with the line conductor 6a, and an inclining part 6d formed to approach the line conductor 6a gradually from the wide interval 6c. Furthermore, a narrow interval 6e is formed at an almost specified interval from the inclining part 6d to the other end side and the forward end of the central conductor 3b is located at a position on the line conductor 6a corresponding to the inclining part 6d. |
