| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer wiring board which has a wiring circuit layer made of a metal foil arranged at least therein, and in which an insulation fault between wiring circuit layers due to the invasion of a moisture does not occur in plating or in a high humidity atmosphere, by generating a gap at the periphery of the internal wiring circuit layer. SOLUTION: A method for manufacturing the multilayer wiring board comprises the steps of coating to form the wring circuit layer 13 made of the metal foil on the surface of a green sheet 11 containing a vitreous component or a mixture of the vitreous component and a ceramic filler component, coating a plasticizer together with an organic binder on the periphery of the layer 13 in a width of 30μm or more to form a plasticizer-containing layer 14, then laminating the green sheets, and baking the laminate. |
