| 摘要 |
<p>In the present method, a device under test (34) is maintained at a generally constant temperature. In furtherance thereof, a thermal head (30) is positioned adjacent the device (34), and a number of functional tests are run on the device (34), causing the power level of the device (34) to vary. The power level of the device (34) is monitored, and the power level of the thermal head (30) is varied so that the sum of the power level of the device under test (34) and the power level of the thermal head (30) remains generally constant.</p> |
