发明名称 VACUUM FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD USING THE APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vacuum film deposition apparatus for depositing a thin film on a surface of a web-like base film by a chemical vapor phase deposition method (CVD method) or the like in which the stability in the film deposition can be improved without increasing the size of an electrode as a film deposition means, and to provide a film deposition method using the apparatus. SOLUTION: In the vacuum film deposition chamber 25 having a web-like base material winding-rewinding chamber 24 and a film deposition chamber 25 to deposit a thin film, the film deposition chamber 25 has the film deposition means comprising shower head electrodes 21a, 21b, 21c, and 21d having a process gas ejection unit, and a power feed pipe 22 of three-layer configuration to feed the power to the electrodes, and the electrodes 21a, 21b, 21c, and 21d are disposed on a lower part of the web base material in a staggered manner in the direction orthogonal to the winding direction.
申请公布号 JP2003096571(A) 申请公布日期 2003.04.03
申请号 JP20010286419 申请日期 2001.09.20
申请人 TOPPAN PRINTING CO LTD 发明人 SHIRAI TSUTOMU;TAKEDA AKIRA;YAMAMOTO KYOICHI;KUSAKA NAOTO;IZUMI MASAKI
分类号 B32B9/00;C23C16/509;C23C16/54;(IPC1-7):C23C16/54 主分类号 B32B9/00
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