发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem that a flow passage to molten solder flow in one direction is made by providing side plates to the both sides of a flow guide plate and a jet stream is formed, a printed wiring board is conveyed in the direction opposite to the jet stream by a conveyance means and soldering is conducted to the printed wiring board, thereby, the flow of the molten solder is disturbed in the vicinity of the side plates, the jet stream is made uneven and the soldering quality is deteriorated. SOLUTION: The flow of the jet stream 2 is made even by forming recessed parts 3 along the side plates 4 of the both sides of the flow guide plate 1 and accelerating the flow of the molten solder 10 in the vicinity of the side plates 4, and the soldering quality is secured.
申请公布号 JP2003094163(A) 申请公布日期 2003.04.02
申请号 JP20010286416 申请日期 2001.09.20
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 IMAMURA KEIICHIRO
分类号 B23K1/00;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/00
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