Radio frequency module

摘要

A radio frequency module includes a first circuit board and a second circuit board. A first circuit element group is placed in a cavity formed on the upper surface of the first circuit board, and a second circuit element group is placed on the upper surface of the second circuit board. The first and second circuit boards are provided with terminal electrodes by which electrical connection is established. The radio frequency module is formed by vertically connecting the two circuit boards together. Heat emitted by the first circuit element group is transferred to a heat radiation section, which is formed on the lower surface of the first circuit board, via through-holes connecting the bottom of the cavity with the heat radiation section.