Hybrid power circuit

摘要

The circuit has a carrier substrate (1) provided on at least one major surface with a power component (2) and on the opposite major surface with a large surface area heat sink (4). An intermediate heat conductive layer (5,6) is provided between the heat sink and the carrier substrate only at points aligned with the power components. Pref. the intermediate heat conductive layer has a thickness of between 20 and 50 microns, its outer contour lying within the outer contour of the power component.