发明名称 HEAT SENSITIVE STENCIL PRINTING BASE PAPER AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a heat sensitive stencil printing base paper having a support preventing the elongation and breakage of the base paper from developing at printing and its manufacturing method, and simultaneously provide the heat sensitive stencil printing base paper, by which no ununiform printing develops and a few offset develops with a small ink spread, and its manufacturing method by executing the bonding between a porous resin layer and a porous fibrous layer within the range of the spread of an adhesive not damaging a permeability to ink and, at the same time, and enhancing a bonding strength, in the heat sensitive stencil printing base paper formed by laminating the porous resin layer made of a resin on one side of a thermoplastic resin film and further the porous fibrous layer made of a fibrous substance on the surface of the porous resin layer. SOLUTION: In the heat sensitive stencil printing base paper having the porous resin layer on one side of the thermoplastic resin film, to the surface of which the porous fibrous layer made of a fibrous substance is bonded through an adhesive, the spread of the adhesive is set to be within the range of 0.05 to 1.5 g/cm<2> and the bonding strength between the porous resin layer and the porous fibrous layer is set to be within the range of 0.8 to 50.0 N/m.
申请公布号 JP2003089283(A) 申请公布日期 2003.03.25
申请号 JP20020017757 申请日期 2002.01.25
申请人 RICOH CO LTD;TOHOKU RICOH CO LTD 发明人 YAMAGUCHI HIDEYUKI
分类号 B41N1/24;(IPC1-7):B41N1/24 主分类号 B41N1/24
代理机构 代理人
主权项
地址