发明名称 METHOD AND DEVICE FOR PROCESSING ARRAY SHAPE, COMPONENT FOR MOLDING ARRAY ELEMENT, AND ARRAY ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method and device for processing array shapes, components for molding array elements, for forming array shapes such as spherical, nonspherical, etc., with enhanced accuracy by aligning array positions on the work accurately and quickly, and an array element. SOLUTION: The processing device 1 processes the work 5 provided in advance with aligning grooves 6 showing the relative position to the center of the array surface to be formed at the array forming surface at a certain pitch, and the work 5 is mounted on a rotary main shaft 3, and the aligning grooves 6 are sensed by a groove sensor 15 or groove position detector 30, and coordination of the aligning grooves 6 with the rotary main shaft 3 is performed, and the work 5 is positioned, and the array surface processing is made to the array forming surface. This allows precise positioning of the work 5 with the rotary main shaft 3, and the array surface can be processed accurately and quickly.
申请公布号 JP2003089001(A) 申请公布日期 2003.03.25
申请号 JP20010281064 申请日期 2001.09.17
申请人 RICOH CO LTD 发明人 KAI SATOSHI;INADA HISASHI;CHO SUSUMU
分类号 B23Q17/24;B23B5/00;B23B5/36;B23B25/06;B24B13/00;(IPC1-7):B23B5/00 主分类号 B23Q17/24
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