发明名称 Method for fabricating a semiconductor device reducing junction leakage current and narrow width effect
摘要 A semiconductor device for reducing junction leakage current and mitigating the narrow width effect, and a fabrication method thereof, are provided. The semiconductor device includes a semiconductor substrate in which an active region and an isolation region including a trench are formed, a spacer which is formed on both sidewalls of the trench, a channel stop impurity region which is self-aligned by the spacer and locally formed only at the lower portion of the isolation region, an isolation insulating layer in which the trench is buried, and a gate pattern which is formed on the isolation insulating layer and the active region. When the channel stop impurity region is formed only at the lower portion of the isolation region, isolation characteristics between unit cells can be improved, and also, a junction leakage current can be reduced. Further, the present invention can reduce a narrow width effect, in which a threshold voltage rapidly decreases as a channel width becomes narrower, owing to the formation of the channel stop impurity region on the edges of the active region.
申请公布号 US6537888(B2) 申请公布日期 2003.03.25
申请号 US20010870298 申请日期 2001.05.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JAE-KYU
分类号 H01L21/76;H01L21/265;H01L21/762;H01L27/08;H01L29/10;(IPC1-7):H01L21/76 主分类号 H01L21/76
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