发明名称 APPARATUS FOR CUTTING AND GRINDING INDUSTRIAL WASTE AND METHOD FOR TREATMENT
摘要 <p>PROBLEM TO BE SOLVED: To realize material recycling by efficient pulverization treatment of a waste vinyl chloride resin flooring material. SOLUTION: Material recycling is realized by pulverizing e.g. a waste flooring material by rotating a cylindrical tool unit having a plurality of steplike cutting edges at a high speed and freely controlling the rotation of the tool, the feed rate and angle of the thing to be ground, etc., in pulverizing a waste flooring material or the like.</p>
申请公布号 JP2003088772(A) 申请公布日期 2003.03.25
申请号 JP20010324200 申请日期 2001.09.17
申请人 RAIZA ENGINEERING KK;GOMISHO:KK 发明人 AMIMOTO KICHINOSUKE;ITO KAZUKO;KAGA YUJI
分类号 B09B5/00;B02C18/14;B02C18/16;B02C18/18;B02C18/22;B09B3/00;B29B17/00;B29B17/02;B29B17/04;B29K25/00;B29K27/06;(IPC1-7):B02C18/14 主分类号 B09B5/00
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