| 摘要 |
PROBLEM TO BE SOLVED: To provide the practical resin sealing method of a collective sealing- type semiconductor device. SOLUTION: A resin composition constituted of multiple components is melted and mixed at the time of use and it is packed and cured at the temperature of not more than 100 deg.C. It is preferable that the resin composition is kept in a stable state in terms of chemical reaction (respective components are separated, the respective components are mixed in a solid state and the respective components are capsuled). It is preferable that the semiconductor device is secondarily cured at the temperature higher than 100 deg.C after cutting. In such a case, it is preferable that the resin composition includes two or above types of catalysts for promoting bridging reaction at the temperature lower than 100 deg.C and that higher than 100 deg.C. |
