发明名称 |
POST IN RING INTERCONNECT USING FOR 3-D STACKING |
摘要 |
A post in ring interconnect used for 3-D stacking. A retaining ring is formed on a pad on a bottom surface of a top PCB substrate to be stacked with a bottom PCB substrate. A post is formed on a pad on a top surface of the bottom PCB substrate. A conductive paste is applied on the pad on the bottom surface of the top PCB substrate and retained in a pocket partially defined by the retaining ring. The retaining ring is aligned with the post. By performing a compression step, a eutectic bond is formed between the top and bottom PCB substrates by the post and the conductive paste.
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申请公布号 |
US2003051906(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20010957190 |
申请日期 |
2001.09.20 |
申请人 |
ROETERS GLEN E.;MANTZ FRANK E. |
发明人 |
ROETERS GLEN E.;MANTZ FRANK E. |
分类号 |
H05K3/32;H05K3/46;(IPC1-7):H05K1/16 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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