Träger-Struktur zum Tragen einer CPU-Wärmeabgabe-Vorrichtung

摘要

A carrier structure supporting a CPU heat dissipating device includes a heat. sink 1 a socket 2 and a plurality of connecting members 3. The heat sink has a plurality of through holes 13. The socket is mounted under the heat sink, and includes a plurality of receiving openings 22 respectively communicating with the through holes 13. The connecting members are respectively mounted in the receiving openings. Each of the connecting members has a resilient element 30 a sleeve 31 and a screwing element 32. The sleeve is placed inside the spring and the screw is placed inside the sleeve. A flange 33 is further formed on a top of the sleeve for pressing against the resilient element. The screwing element is longer than the sleeve. The heatsink 1 further includes a heating tube 10 and a plurality of fins 12.