| 摘要 |
PROBLEM TO BE SOLVED: To provide an effective method for sealing a device without influencing the quality and property of a substrate of an active element. SOLUTION: An active element is mounted to the upper part of a substrate, and a cap, to be used for sealing the active device mounted on the substrate, is prepared. Adhesive agent is applied to the area of the cap where the cap contacts with the substrate, or to the area of the substrate where the substrate contacts the cap, and bridging is made to start while making the adhesive agent stay in liquid phase by applying partial cure, and the cap is put on the substrate, and the device is sealed by curing the adhesive agent. |
