| 摘要 |
<p>A flame-retardant heat-resistant resin composition which comprises (A) a modified polyamide-imide resin, (B) a thermosetting resin, and (C) an organophosphorus compound and which upon curing gives a film having a storage modulus of 700 MPa or lower, a coefficient of thermal expansion of 5x10-3 /K or lower, and an internal stress of 20 MPa or lower as measured in the temperature range of 25 to 250°C.</p> |
