| 摘要 |
The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment, and can produce the electronic component with high accuracy and with significantly increased productivity. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer-insulating layer-conductive inorganic material layer or a laminate of conductive inorganic material layer-insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer, wherein: the insulating layer in the laminate is wet etchable and has a single-layer structure or a laminate structure of two or more insulation unit layers; after the patterning of the conductive inorganic material layer in the laminate, the patterning of the insulating layer by wet etching is carried out in a continuous form in a continuous feed, continuous production line using a dry film resist; and, in patterning the insulating layer using the dry film, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.
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