| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a mold releasability-restoring resin composition excellent in mold releasability-restoring properties for a mold for semiconductor-sealing. SOLUTION: An epoxy resin (A), a phenolic resin (B), a curing accelerator (C), a reaction product of an oxidizedα-olefin with ethanolamine and/or a reaction product of an oxidizedα-olefin with an isocyanate (D1) and an inorganic filler (E) as essential ingredients are kneaded under heating, cooled and crushed to give a crushed matter having a particle size of 4 mesh or less. Other reaction product of an oxidizedα-olefin with ethanolamine and/or other reaction product of an oxidizedα-olefin with an isocyanate (D2) are admixed with the crushed matter to give the mold releasability-restoring resin composition. The compounding ratio is such that [(D1)+(D2)] is 0.1-3 wt.% of the whole resin composition and that [(D2)]/[(D1)+(D2)]>=25 wt.%, and the particle size of (D2) is at least 60 mesh and at most 16 mesh.
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