发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide composition having a low coefficient of friction, a high limiting PV value, excellent sliding properties, excellent mechanical strengths, heat resistance, low water absorption properties and dimensional stability and a molding composed of the same. SOLUTION: This polyamide composition comprises 100 parts.wt. of a polyamide (A) composed of a dicarboxylic acid unit (a) containing 60-100 mol % of a terephthalic acid unit and a diamine unit (b) containing 60-100 mol % of a 6-18C aliphatic alkylenediamine unit and 0.1-30 parts.wt. of a silicone (B). This molding comprises the polyamide composition.
申请公布号 JP2003082227(A) 申请公布日期 2003.03.19
申请号 JP20010277754 申请日期 2001.09.13
申请人 KURARAY CO LTD 发明人 OKA HIDEAKI;SASAKI SHIGERU
分类号 C08J5/00;C08K3/10;C08L77/06;(IPC1-7):C08L77/06 主分类号 C08J5/00
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