ADHESIVE FILM FOR SEMICONDUCTOR AND ITS APPLICATION

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film formed on a base film having a low linear expansion coefficient, which does not cause warpage when it is bonded to a semiconductor substrate having a large adhesive area. SOLUTION: In the adhesive film for the semiconductor with a base film used in a sticking method of the film sticking to an area not less than half of the semiconductor substrate in the block, the film comprises the base film having the linear expansion coefficient at 30-180 deg.C being <=20 ppm/ deg.C and an adhesive layer formed thereon.