| 摘要 |
PROBLEM TO BE SOLVED: To provide a die cooling device which can avoid any flow troubles of a cooling solution caused in the vicinity of a bottom surface and perform adequate cooling effect by improving the peripheral shape of the bottom surface in a bottomed cooling hole of a die with inner and outer pipes connected thereto or the positional relationship between the bottom surface and the inner pipe. SOLUTION: A flat surface part 7a facing a tip opening part of the inner pipe 2 closely thereto is formed in a center area of the bottom surface 7 in the bottomed cooling hole 6 provided in the die 4, and a curved surface part 7b continuous to an inner circumferential surface 6a of the bottomed cooling hole 6 from the flat surface part 7a is formed in an outer circumferential area. The distance S between the bottom surface 7 of the bottomed cooling hole 6 and the tip of the inner pipe 2 is set to be <=5 times the inside diameter d of the inner pipe 2, and preferably <=3 times or <=2 times thereof. More specifically, the distance S is set to be 2.0-5.0 mm, preferably, 2.5-3.0 mm.
|
