| 摘要 |
PROBLEM TO BE SOLVED: To provide an accommodation structure of an electronic circuit package that can secure a sufficient opening area for improving cooling capability, can increase packaging density in an electronic circuit package, and can reduce costs. SOLUTION: By a machining apparatus used for forming guide rails 23 that are provided on the upper and lower surfaces of a subrack 1 for accommodating an electronic circuit package 31, and a plurality of ventilation ports 11 and 13 that are formed side by side in the guide direction of the electronic circuit package 31 between the guide, rails 23, a communication hole 15 for allowing the ventilation ports 11 and 13 that are aligned in the guide direction to communicate each other is formed, and the opening area of the ventilation ports of the entire subrack 1 is expanded.
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