Electronic component, for memory storage, comprises large semiconductor chip and small semiconductor chip, each with contact surfaces and bond wires for contacting with substrate

摘要

Electronic component comprises large semiconductor chip (1) and small semiconductor chip (2), each with contact surfaces (3, 8) and bond wires (5, 7) for contacting with substrate (11) with wiring plane (6) with contact connecting surfaces (14) and outer contact surfaces (15). The semiconductor chips are arranged on the substrate and plastic filler (10) is provided between the substrate and the large semiconductor chip. An Independent claim is also included for a process for the production of the electronic component.