| 摘要 |
This specification describes techniques for building lightweight computing devices that may weigh less than one pound. The computing device may include a motherboard, a keyboard, and a display. Alternatively it may include a motherboard, a display, and speech-processing capabilities. The motherboard is preferably built on a flexible substrate using a rigid carrier. IC chips are attached using flip chip bonds that employ stud bumps on the IC chips, and corresponding wells filled with solder on the motherboard. The display and keyboard roll up when not in use and employ super-elastic materials as stiffeners. The computing device may be implemented as a mobile computer, and may include a camera, and biometric security features. Passive cooling is employed, using the area of the roll up devices.
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