发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which has a high strength and rigidity such as high creep characteristics and develops an excellent effect also on surface appearance. SOLUTION: This polyamide resin composition comprises (A) 100 pts.wt. of a polyamide containing polyhexamethylene adipamide as a main constituent, (B) 0.05 to 30 pts.wt. of a swelling laminar silicate, (C) 0.001 to 0.5 pt.wt. of a copper compound, (D) 0.01 to 0.5 pt.wt. of a compound selected from aliphatic amides, fatty acids and their derivatives, and (E) 0.01 to 0.5 pt.wt. of a higher fatty acid metal salt.
申请公布号 JP2003073542(A) 申请公布日期 2003.03.12
申请号 JP20010266574 申请日期 2001.09.03
申请人 TORAY IND INC 发明人 SAITO MAKIKO;NISHIMURA TORU
分类号 C08J5/00;C08K3/16;C08K3/34;C08K5/098;C08K5/20;C08L77/06;(IPC1-7):C08L77/06 主分类号 C08J5/00
代理机构 代理人
主权项
地址