CMP CONDITIONER, METHOD FOR ARRANGING HARD ABRASIVE GRAIN USED IN CMP CONDITIONER AND METHOD FOR MANUFACTURING CMP CONDITIONER

摘要

PROBLEM TO BE SOLVED: To provide stable CMP conditioner characteristics and to relieve slurry or the like in polishing without forming relief groove or the like on a support member. SOLUTION: This CMP conditioner of polishing cloth for a semiconductor substrate is composed of the support member 1 and plural diamond grains 2 brazed on a surface of the supporting member 1. Plural straight lines or curved lines radially extending from a center of the support member 1 are laid out on the surface of the disk-shaped support member 1 and the diamond grains 2 are arranged on the straight lines or the curved lines. The diamond grains 2 are arranged in such a manner that density of the diamond grains 2 at edge parts is smaller than that at a center par of the support member 1. Since area where no diamond grain 2 exists is secured in radial shape on the surface of the support member 1, slurry can be relieved outward from the support member 1 in polishing.