发明名称 THERMAL DECOMPOSITION RESIDUE COOLING DEVICE AND WASTE DISPOSAL PLANT HAVING THE THERMAL DECOMPOSITION RESIDUE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve environment, get through with by reducing the frequency of maintenance, and can form a device in a compact manner by enabling shortening of a device length. SOLUTION: The thermal decomposition residue of a thermal decomposition residue, obtained by indirectly heating waste of the thermal decomposition residue, and thermal decomposition gas is received and the thermal decomposition residue is cooled and fed to the thermal decomposition residue selecting device side. The so formed thermal decomposition residue device is provided with a horizontal type drum part 30 to receive the thermal decomposition residue from the one end side and rotate around an axis O and discharge the residue from the other end side; and a cooling part 31 to cool the drum part 30. The drum part 30 is constituted such that a plurality of drums 32 situated along the axis O are disposed in dispersion around the axis O.
申请公布号 JP2003074829(A) 申请公布日期 2003.03.12
申请号 JP20010265645 申请日期 2001.09.03
申请人 TAKUMA CO LTD 发明人 AYUKAWA DAISUKE
分类号 F23J1/00;B09B3/00;F23G5/00;F23G5/027;(IPC1-7):F23J1/00 主分类号 F23J1/00
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