| 摘要 |
PROBLEM TO BE SOLVED: To establish an adhesive technique capable of stably providing a printed wiring board and various metal adherends for other industrial parts exhibiting excellent adhesion strength between a coating metal and an adhesive layer even in the case of wiring of high density and high pattern accuracy. SOLUTION: As a heat-resistant resin matrix of the adhesive, a homogeneous mixture of a thermosetting resin and/or a photosensitive resin with a thermoplastic resin is employed. The homogeneous mixture hardens to a homogeneous resin composite having a pseudo-uniform compatibilized structure, a co- continuous structure or a spherical domain structure. This resin composite is employed as a heat-resistant resin matrix of the adhesive layer.
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