| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering method, which reduces the number of samples made for confirming the relationship among film forming hours, film thickness and film resistance, and can reduce dummy substrates and man-hours for sample making, and provide a sputtering apparatus therefor. SOLUTION: The objective sputtering apparatus 101 has a mask 103 which is held by a shaft 102 so as to be rotatable through a rotational drive system (not shown), in a space between a target 3 and a substrate 5 to be treated, and which is used for forming a film on a dummy substrate 5b. The mask 103 has an opening 104 through which the sputtering treatment is performed, and has a structure which can either vary the position of the opening 104, or expand the area of the opening 104 step by step.
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