| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of realizing machining satisfactory in parallelism and passing through property with high precision. SOLUTION: In the laser beam device provided with an adsorption plate 1 for placing a material 3 to be machined, and a holding stand 2 for holding the adsorption plate 1 to conduct machining by radiating a laser beam 4 to the material 3 to be machined, passing through holes 5 are provided on a plurality of parts of the adsorption plate 1 corresponding to the part immediately below the material to be machined irradiated with the laser beam 4, passing through holes 6 are provided on a plurality of the adsorption plate 1 not irradiated with the laser beam 4, and the adsorption parts 10a against the plurality of the passing through holes 5 provided on the adsorption plate 1 corresponding to the part immediately below the material 3 to be machined irradiated with the laser beam 4, and the adsorption part 10b against the plurality of the passing through holes 6 provided on the part of the adsorption plate 1 not irradiated with the laser beam 4 are independent respectively.</p> |
