发明名称 |
METHOD FOR PRODUCING ELECTRONIC COMPONENTS |
摘要 |
A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer. |
申请公布号 |
AU2002342623(A1) |
申请公布日期 |
2003.03.10 |
申请号 |
AU20020342623 |
申请日期 |
2002.08.26 |
申请人 |
SCHOTT GLAS |
发明人 |
JURGEN LEIB;FLORIAN BIECK |
分类号 |
H01L27/14;H01B13/00;H01L;H01L25/16;H01L31/02;H01L31/0232;H01L33/00 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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