| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that in insulation films made of organic materials and a multiplayer interconnection board using the same, the increased density of its wirings, its insulating quality, the reliability of its continuity, and its high-frequency transmission characteristic cannot be satisfied collectively. SOLUTION: The multiplayer interconnection board 6 comprises a plurality of insulation films 3 and a plurality of wiring conductors 4 made of metallic foils each of which is provided on at least one of the upper and lower surfaces of the film 3. Each insulation film 3 comprises a liquid crystal polymer layer 1 wherein its contact angle with triallylisocyanurate is 3-5 deg. and its surface energy is 45-70 mJ/m<2> , and coating layers 2 made of polyphenylene ether-based organic matters which are formed on the upper and lower surfaces of the layer 1. Further, each through conductor 5 formed in each insulation film 3 is provided electrically connectively between the wiring conductors 4 so positioned on the upper and lower sides of each film 3 as to sandwich each film 3. |
