| 摘要 |
PROBLEM TO BE SOLVED: To fabricate a flexible printed board which enables response to the shrinkage and the increase in density of a circuit while maintaining the adhesiveness between a metal thin film and a high molecular film, and which enables a remarkable reduction in cost by reducing the number of processes. SOLUTION: When forming a single layer or a multilayer of copper, nickel, chromium or other metals on the surface of the high molecular film by vacuum evaporation, the surface of the high molecular film is coated with a mask formed with a circuit pattern or by a similar method. Thereafter, metals are evaporated on the surface of the high molecular film coated with the mask to build in a circuit at the same time with the formation of a film.
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