| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which can calculate an accurate pad position in spite of expansion of IC chip by heat and can calculate the lead position of a bonded part without detecting each lead position by a lead locator. SOLUTION: A bonding position is calculated by operating a step to calculate a fixed point on a XY orthogonal axis by deviation volumes of at least 3 locations detected by a deviation volume detecting means, a step to calculate the scale element values of a X axis and a Y axis, skew element values of the X axis and the Y axis and offset values of the X axis and the Y axis of a conversion matrix (scaling matrix) by a reference position of the fixed point and a position which the fixed point detects. |
