| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a semiconductor element is thermally broken since heat that the semiconductor element generates when operating can not efficiently be radiated to the outside. SOLUTION: The package for semiconductor element storage comprises a base body 1, a frame-shaped insulator 2 having a wiring layer 6, and a lid body 3; and the frame-shaped insulator 2 is formed of crystalline glass composed of 40 to 46 wt.% silicon oxide, 25 to 30 wt.% aluminum oxide, 8 to 13 wt.% magnesium oxide, 6 to 9 wt.% zinc oxide, and 8 to 11 wt.% boron oxide and the base body 1 is composed of tungsten and copper and has a three-layered structure having upper and lower layers 1b and 1d of 35 to 50 wt.% tungsten and 50 to 60 wt.% copper on both top and reverse surfaces of an intermediate layer 1c composed of 55 to 95 wt.% and 5 to 45 wt.% copper. |
