SEMICONDUCTOR DEVICE, IMAGE READING UNIT AND IMAGE FORMING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which does not need to make a projecting object and can prevent parasitic capacitance. SOLUTION: The semiconductor device flip-chip-connects a semiconductor element 2 having a function face 2a at its front face to a substrate 1 having a wiring portion 5. An adhesive 3 to fix the semiconductor element 2 and the substrate 1 glues the substrate 1 to at least one face left after both the front face and a rear face of the semiconductor element 2 are removed. No adhesive comes into a gap between the substrate 1 and the semiconductor element 2.