发明名称 LAYERED CIRCUIT BOARDS AND METHODS OF PRODUCTION THEREOF
摘要 <p>Compositions and methods are provided whereby layered materials, electronic components and electronic products may be produced comprising: a substrate (10), an active component layer (20) that comprises an active material coupled to an adhesion promoter layer (30), wherein the adhesive promoter layer is selectively patterned to expose a contact area on the active material; and at least an additional layer (40).</p>
申请公布号 WO2003020004(A1) 申请公布日期 2003.03.06
申请号 US2002027299 申请日期 2002.08.26
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