Liquid-cooled power module

摘要

Invention concerns a liquid-cooled power module, where a semiconductor substrate is directly or indirectly configured on to cooling body. The cooling body includes a cooling chamber through which the cooling fluid streams. As the semiconductor substrate and the cooling body consist of different materials, there are differences in the thermal expansion coefficients. These difference results in occurrence of dislodgement force between the semiconductor and the cooling body, so that brazing and thereby the heat transfer is broken. This will lead to loss of the semiconductor effect. To avoid this a solution is recommended, where a shock-absorbing joint is fixed in the wall of the cooling body, which can take up thermal generating voltage and movements. An elasticity is hereby reached that reduces thermal stress, and the power module's reliability and lifetime are increased.<IMAGE>