发明名称 PHOTOSENSITIVE RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin and a photosensitive resin composition excellent in stability after the preparation of the composition, thermal stability in a solvent volatilizing step, suitability to set to touch after the volatilization of the solvent and developability in a dilute aqueous alkali solution and giving a finally cured coating excellent in flexibility, heat resistance, resistance to the heat of soldering, adhesion, water resistance, chemical resistance, etc. SOLUTION: The photosensitive resin is obtained by reacting a copolymer (I) obtained by copolymerizing one or more unsaturated monobasic acids and styrene with a compound having an unsaturated group and an epoxy resin in one molecule in the presence of one or more catalysts selected from the group comprising lithium naphthenate, zirconium naphthenate, chromium naphthenate, chromium acetylacetonate, chromium chloride and triphenylphosphine.
申请公布号 JP2003057821(A) 申请公布日期 2003.02.28
申请号 JP20010245414 申请日期 2001.08.13
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 TOMIYAMA TORU;SAITO TAKESHI;KIKAWA TAKUYA;OTANI KAZUO
分类号 G03F7/038;C08F8/00;C08G59/62;G03F7/032;H05K3/28 主分类号 G03F7/038
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