| 摘要 |
PROBLEM TO BE SOLVED: To achieve a packaging method for packaging electronic components without applying tension due to a crimp head to a protection tape, and to achieve a manufacturing method of liquid crystal display elements. SOLUTION: The packaging method for crimping an electronic component by a crimp head via a protection tape includes a process for moving the protection tape, and a process for crimping the electronic component by the crimp head. In the protection tape, ion side is wound off by a wind-off means, and the other is wound up by a wind-up means. In a process for moving the protection tape, the wind-off and wind-up means should also be moved.
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