| 发明名称 |
UV-FREE CURING OF ORGANIC DIELECTRICA |
| 摘要 |
Disclosed are methods of manufacturing electronic devices, particularly integrated circuits, containing organic polysilica low dielectric constant materials. Such methods provide enhanced adhesion of polymeric materials to the organic polysilica dielectric materials. |
| 申请公布号 |
WO0245145(A3) |
申请公布日期 |
2003.02.27 |
| 申请号 |
WO2001US44913 |
申请日期 |
2001.11.30 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
GALLAGHER, MICHAEL, K.;YOU, YUJIAN;ROCHE, MAUREEN |
| 分类号 |
H01L21/3105;H01L21/312;H01L21/316 |
主分类号 |
H01L21/3105 |
| 代理机构 |
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代理人 |
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