| 摘要 |
A semiconductor device, which may be changed to a mirror package after the assembly without having to reinstall bonding wires, comprises: a plurality of fixed external terminals which include a power supply external terminal and a ground potential external terminal and which are arranged symmetrically in fixed positions; a plurality of variable external terminals of different types which are arranged symmetrically; a plurality of reverse-polarity selection external terminals which are symmetrically arranged in fixed positions, and a signal switching circuit which switches the arrangement of the symmetrically arranged variable external terminal according to the setting of the selection terminal. |
