发明名称 METHOD AND DEVICE FOR CONTROLLING LASER CUTTING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method or controlling a laser cutting by which a work is appropriately cut by detecting plasma generated during the laser beam machining of the work at an earlier stage. SOLUTION: The plasma generated during the cutting the work W is detected at an earlier stage with a first and a second optical detectors 20 and 21 housed in a guide cylinder 13 and the detected signals are synthesized with a mixer 23 and amplified with a photosensor amplifying circuit 24. When the plasma is generated, the intensity of an ultraviolet ray of which the wavelength is approximately 405 nm is detected and a speed reduction signal for the machining speed is outputted from a controller 16 to a servo motor 19 when the intensity of the ultraviolet ray reaches a preliminarily subscribed value for commanding the reduction in the machining speed. The cutting is switched to be performed at the original speed by gradually increasing the machining speed when the plasma disappears in the cutting groove of the work W and the intensity of the ultraviolet ray becomes the value for commanding the recovery of the machining speed or slower.</p>
申请公布号 JP2003053568(A) 申请公布日期 2003.02.26
申请号 JP20010242625 申请日期 2001.08.09
申请人 NIPPEI TOYAMA CORP 发明人 MORITA YUICHI
分类号 B23K26/00;B23K26/38;B23K103/04;(IPC1-7):B23K26/00 主分类号 B23K26/00
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