发明名称 METHOD FOR FORMING FILM PATTERN
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for forming film pattern which is high in precision, is easily discriminated, does not necessitate rigid mechanical accuracy and, moreover, is low in costs. SOLUTION: This method for forming film pattern is composed of a step of irradiating a film 2 which becomes a raw material of a pattern with which the surface of a substrate 1 is covered with laser 5 through a substrate, a step of sticking the film to an object 3 for pattern formation which is disposed in the vicinity of the substrate or in close contact with the substrate and forming a film pattern 4, a step of irradiating a prescribed part of the film pattern with laser after forming the film pattern and a step of removing one part of the film pattern. Therein, the substrate is preferably a transmission body which transmits laser or glass and it is also preferable that laser is applied through the object for pattern formation.</p>
申请公布号 JP2003053559(A) 申请公布日期 2003.02.26
申请号 JP20010249133 申请日期 2001.08.20
申请人 YASKAWA ELECTRIC CORP 发明人 HAYAKAWA HIROTOSHI
分类号 B23K26/00;G06K1/12;(IPC1-7):B23K26/00 主分类号 B23K26/00
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