| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment method and a vacuum treatment device in which decrease in yield is minimized even when any abnormality occurs in the vacuum treatment, and a large number of high quality works are formed at a low cost. SOLUTION: In the vacuum treatment in which each reaction vessel is connected to a pipe branched from one and the same exhaust means and a gas feed and flow rate control means, and evacuated, gas required for treating each reaction vessel is introduced, the high frequency power is simultaneously applied to each reaction vessel to form plasma, and a plurality of works are simultaneously treated, the vacuum treatment of the reaction vessel in which an abnormality occurs is stopped when any abnormality in the vacuum treatment occurs in at least one reaction vessel, the vacuum treatment control set value is changed from the normal set value. |
