| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module in which a heat generated by an electronic component is uniformly and efficiently radiated and which can be mounted in high density, and to provide a method for manufacturing the same. SOLUTION: The power module comprises a circuit board (103) in which a heating component (101) is electrically connected and which is connected to a heat sink (105) via a heat conductive electric insulating member (104). In this module, the insulating member (104) is a curable composition containing a thermosetting resin (A), a thermoplastic resin (B), a latent curing agent (C), and an inorganic filler (D). The insulating member is adhered to the heating component in a state in which the member is complementarily deformed to unevennesses of a shape of the heating component and a component height. A heat generated by the component (101) is radiated by the heat sink (105). |
