METHOD FOR MANUFACTURING EXPOSURE MASK, METHOD FOR GENERATING MASK BASE PLATE INFORMATION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, MASK BASE PLATE, EXPOSURE MASK AND SERVER

摘要

PROBLEM TO BE SOLVED: To realize a method for manufacturing an exposure mask which is effective to solve a problem on the lowering of the yield of a product caused by the deterioration of the flatness of a mask base plate by chucking the mask base plate on the mask stage of a wafer aligner. SOLUTION: The surface shape of the principal surface of each of a plurality of mask base plates and the flatness of the principal surface thereof before and after chucking the mask base plate on the mask stage of the aligner are acquired (step S3), the mask base plate having the surface shape having good flatness both before and after it is chucked on the mask stage is prepared (step S5), and a desired pattern is formed on the mask base plate, whereby the exposure mask is formed (step S6).